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硅晶圆片

硅晶圆片

product description

ICC提供切割、研磨和2”至8”晶圆的毛坯。包括光学、镜面和半导体级硅材料。

 

Applications :

Structure: Mono crystalline

Growing method: CZ/FZ

Type: N/P

Orientation: <111> <100> <110>

Resistivity: 0.05-10000ohm.cm

Grade: Optical/Mirror/Semiconductor/Tar get

Dislocation density: None

Density: 2.33g/cm3

Melting Point : 1414℃

Transmission range: 1.2-15um

Optical application:band pass filter, thermography, ATR crystal, mirrors,wafer,windows,lenses,ban d pass filter, ATR crystals,etc.

 

Product Advantage :

公司拥有单线切割机、多线锯床和数控切割机。

 

公司拥有20多台硅片及其它窗口抛光机。

 

ICC设有两套超声波清洗,工作人员穿着洁净室工作服,以保护洁净度和颗粒。

Product Parameters :

Intrinsic Crystal Technology, provides standard wafers for the semiconductor industry, optical filters, and IC silicon dioxide.

A. Standard Dimensions: 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches (300 mm)

B. Resistivity and use – Whether it is SEMI /IC/FILTER grade

C. Polishing requirements: Surface quality of monocrystal silicon polishes: no channel, no erosion pits, no fog, no regional contamination, no edge breakage, no cracks, no pits, no trenches, no mounds, no knife marks, etc.No area stain, no edge collapse, no crack, no knife mark on the back.

 thickness (T), 200-1200 um

 total thickness variation (TTV) < 10 um

 bending (BOW) < 35 um

 WARP degrees (WARP) < 35 um

 grinding chengdu: SSP/DSP/lap

 resistance range: the smaller the price more expensive,

 size range: more is not a standard range prices more expensive

 crystal direction: “100”, “111” “110”, if you need reference surface

 roughness: standard is less than 0.5 nm

 flatness: standard is less than 3 um

D. Oxidation treatment: 50nm ~6000nm (routine: 100nm, 200nm, 300nm, 500nm, 1000nm)

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